IN THIS TECHNICAL PAPER...

Learn how OptiSonic machining technology allows you to increase processing speeds while reducing grinding forces on the part.

  • Find out how to overcome the challenges associated with machining hard ceramic optical materials such as sapphire, ALON, Spinel, PCA, or Silicon Carbide 
  • Discover the benefits of OptiSonic's ability to reduce grinding forces by up to 50% 
  • See results for different use cases, including core drill application, Sapphire, and sub-surface damage testing
Ultrasonic Grinding of Optical Materials

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Michael Cahill, Michael Bechtold, Edward Fess, Thomas Stephan, Rob Bechtold "Ultrasonic grinding of optical materials", Proc. SPIE 10448, Optifab 2017, 1044807 (24 October 2017); doi: 10.1117/12.2279825  

Copyright 2017 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited. 

Read abstract: https://doi.org/10.1117/12.2279825


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