IN THIS TECHNICAL PAPER...

Learn how OptiSonic machining technology allows you to increase processing speeds while reducing grinding forces on the part.

  • Find out how to overcome the challenges associated with machining hard ceramic optical materials such as sapphire, ALON, Spinel, PCA, or Silicon Carbide 
  • Discover the benefits of OptiSonic's ability to reduce grinding forces by up to 50% 
  • See results for different use cases, including core drill application, Sapphire, and sub-surface damage testing
Ultrasonic Grinding of Optical Materials

Michael Cahill, Michael Bechtold, Edward Fess, Thomas Stephan, Rob Bechtold "Ultrasonic grinding of optical materials", Proc. SPIE 10448, Optifab 2017, 1044807 (24 October 2017); doi: 10.1117/12.2279825  

Copyright 2017 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited. 

Read abstract: https://doi.org/10.1117/12.2279825


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