IN THIS TECHNICAL PAPER...

Learn how OptiSonic machining technology allows you to increase processing speeds while reducing grinding forces on the part.

  • Find out how to overcome the challenges associated with machining hard ceramic optical materials such as sapphire, ALON, Spinel, PCA, or Silicon Carbide 
  • Discover the benefits of OptiSonic's ability to reduce grinding forces by up to 50% 
  • See results for different use cases, including core drill application, Sapphire, and sub-surface damage testing
Ultrasonic Grinding of Optical Materials

Michael Cahill, Michael Bechtold, Edward Fess, Thomas Stephan, Rob Bechtold "Ultrasonic grinding of optical materials", Proc. SPIE 10448, Optifab 2017, 1044807 (24 October 2017); doi: 10.1117/12.2279825 © (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only. Read abstract: https://doi.org/10.1117/12.2279825


6368 Dean Parkway, Ontario, NY 14519

585-265-0160 | sales@optipro.com